Differences

This shows you the differences between two versions of the page.

--- bonding:start [2019/03/05 00:22] – created mcmaster
+++ bonding:start [2019/03/05 00:28] (current) – mcmaster
@@ Line 3: / Line 3: @@
 During reverse engineering activities, it is often necessary to [[bonding:removal|remove unwanted bonds]] and/or re-bond depackaged devices.
-Equipment specific information has been moved to: https://microwiki.org/wiki/index.php/Bonder
+Information on bonding technologies:
+  * [[bonding:flipchip]]
+For information on how to do bonding (equipment, techniques, etc) see: https://microwiki.org/wiki/index.php/Bonder