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carrier [2012/11/11 09:08] – [Resin mould] azonenbergcarrier [2015/12/17 23:30] (current) – [Bonding wire] azonenberg
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 ====== Resin mould ======  ====== Resin mould ====== 
 +
 +[[carrier:epoxy|See for more detail]]
  
 Its purpose is to protect the fragile die contained within. This includes physical stress and chemical stress such as moisture. On more advanced chips, it may also provide radiation protection or protections against reverse engineering. Typically an epoxy resin mixed with various additives such as glass. Its purpose is to protect the fragile die contained within. This includes physical stress and chemical stress such as moisture. On more advanced chips, it may also provide radiation protection or protections against reverse engineering. Typically an epoxy resin mixed with various additives such as glass.
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 The center portion is called by many names.  Some of them include: The center portion is called by many names.  Some of them include:
-  * Carrier island (eg by Beck's failure analysis) 
   * Paddle (as found in [[http://www.freepatentsonline.com/7638862.html|US patent 7638862]])   * Paddle (as found in [[http://www.freepatentsonline.com/7638862.html|US patent 7638862]])
 +  * Die mounting paddle [Plastic MEMS 68]
 +  * Carrier island (eg by Beck's failure analysis)
   * Mounting surface (as found in [[http://www.freepatentsonline.com/5610437.html|US patent 5610437]])   * Mounting surface (as found in [[http://www.freepatentsonline.com/5610437.html|US patent 5610437]])
   * Die attach pad (as found [[http://electronicdesign.com/article/components/packaging-technology-combines-array-performance-wi|here]])   * Die attach pad (as found [[http://electronicdesign.com/article/components/packaging-technology-combines-array-performance-wi|here]])
   * Ceramic chip has "gold backing" and "bonding pad" [[http://www.tpub.com/neets/book7/25i.htm|here]]   * Ceramic chip has "gold backing" and "bonding pad" [[http://www.tpub.com/neets/book7/25i.htm|here]]
  
-As Beck's failure analysis is a well written published work I refer to it as a "carrier island."+As Beck's failure analysis is a well written published work I originally referred to it as a "carrier island."  However, die attach paddle or simply "paddle" seems to be the most common so I've standardized on that. 
 + 
 +[[carrier:die_attach|See here for more info on attaching dies to carrier]] 
  
 ====== Bonding wire ======  ====== Bonding wire ====== 
  
-Thin, usually gold, wires to electrically connect the leadframe to the die. They are typically welded die or connected via conductive epoxy. Connection to the leadframe is probably welded, need some evidence though.+Thin, usually gold, wires to electrically connect the leadframe to the die. For more details see the article on [[bonding:start|wire bonding]].
  
 ====== Types ======  ====== Types ====== 
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 [[carrier:start]] [[carrier:start]]
  
 +====== References ======
  
 +  * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf
carrier.1352624894.txt.gz · Last modified: 2013/10/20 14:59 (external edit)