Differences

This shows you the differences between two versions of the page.

--- carrier [2013/05/01 05:14] – [Leadframe] mcmaster
+++ carrier [2015/12/17 23:30] (current) – [Bonding wire] azonenberg
@@ Line 9: / Line 9: @@
 ====== Resin mould ======
+[[carrier:epoxy|See for more detail]]
 Its purpose is to protect the fragile die contained within. This includes physical stress and chemical stress such as moisture. On more advanced chips, it may also provide radiation protection or protections against reverse engineering. Typically an epoxy resin mixed with various additives such as glass.
@@ Line 18: / Line 20: @@
 The center portion is called by many names.  Some of them include:
   * Paddle (as found in [[http://www.freepatentsonline.com/7638862.html|US patent 7638862]])
+  * Die mounting paddle [Plastic MEMS 68]
   * Carrier island (eg by Beck's failure analysis)
   * Mounting surface (as found in [[http://www.freepatentsonline.com/5610437.html|US patent 5610437]])
@@ Line 24: / Line 27: @@
 As Beck's failure analysis is a well written published work I originally referred to it as a "carrier island."  However, die attach paddle or simply "paddle" seems to be the most common so I've standardized on that.
+[[carrier:die_attach|See here for more info on attaching dies to carrier]]
 ====== Bonding wire ======
-Thin, usually gold, wires to electrically connect the leadframe to the die. They are typically welded die or connected via conductive epoxy. Connection to the leadframe is probably welded, need some evidence though.
+Thin, usually gold, wires to electrically connect the leadframe to the die. For more details see the article on [[bonding:start|wire bonding]].
 ====== Types ======
@@ Line 33: / Line 39: @@
 [[carrier:start]]
+====== References ======
+  * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf