Differences

This shows you the differences between two versions of the page.

--- carrier [2013/05/01 05:14] – [Resin mould] mcmaster
+++ carrier [2015/12/17 23:30] (current) – [Bonding wire] azonenberg
@@ Line 20: / Line 20: @@
 The center portion is called by many names.  Some of them include:
   * Paddle (as found in [[http://www.freepatentsonline.com/7638862.html|US patent 7638862]])
+  * Die mounting paddle [Plastic MEMS 68]
   * Carrier island (eg by Beck's failure analysis)
   * Mounting surface (as found in [[http://www.freepatentsonline.com/5610437.html|US patent 5610437]])
@@ Line 26: / Line 27: @@
 As Beck's failure analysis is a well written published work I originally referred to it as a "carrier island."  However, die attach paddle or simply "paddle" seems to be the most common so I've standardized on that.
+[[carrier:die_attach|See here for more info on attaching dies to carrier]]
 ====== Bonding wire ======
-Thin, usually gold, wires to electrically connect the leadframe to the die. They are typically welded die or connected via conductive epoxy. Connection to the leadframe is probably welded, need some evidence though.
+Thin, usually gold, wires to electrically connect the leadframe to the die. For more details see the article on [[bonding:start|wire bonding]].
 ====== Types ======
@@ Line 35: / Line 39: @@
 [[carrier:start]]
+====== References ======
+  * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf