Differences

This shows you the differences between two versions of the page.

--- carrier [2013/05/01 05:15] – mcmaster
+++ carrier [2015/12/17 23:30] (current) – [Bonding wire] azonenberg
@@ Line 20: / Line 20: @@
 The center portion is called by many names.  Some of them include:
   * Paddle (as found in [[http://www.freepatentsonline.com/7638862.html|US patent 7638862]])
+  * Die mounting paddle [Plastic MEMS 68]
   * Carrier island (eg by Beck's failure analysis)
   * Mounting surface (as found in [[http://www.freepatentsonline.com/5610437.html|US patent 5610437]])
@@ Line 32: / Line 33: @@
 ====== Bonding wire ======
-Thin, usually gold, wires to electrically connect the leadframe to the die. They are typically welded die or connected via conductive epoxy. Connection to the leadframe is probably welded, need some evidence though.
+Thin, usually gold, wires to electrically connect the leadframe to the die. For more details see the article on [[bonding:start|wire bonding]].
 ====== Types ======
@@ Line 38: / Line 39: @@
 [[carrier:start]]
+====== References ======
+  * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf