Differences

This shows you the differences between two versions of the page.

--- decap:hybrid [2012/02/20 09:34] – created mcmaster
+++ decap:hybrid [2013/10/20 14:59] (current) – external edit 127.0.0.1
@@ Line 24: / Line 24: @@
   - Heat chip
   - Using rotary tool (Dremel), sand down until bond wires are present.
-  -# Should be able to be done in a few minutes
+    - Should be able to be done in a few minutes
-  -# Sanding down until the die is visible is possible, but if will be followed with nitric bath anyway, is not worth the risk
+    - Sanding down until the die is visible is possible, but if will be followed with nitric bath anyway, is not worth the risk
-  -# Squirting with fluid or using magnification may help to show the bond wire
+    - Squirting with fluid or using magnification may help to show the bond wire
   - Pull up external leads towards the ground surface. This should deteriorate the top layer and leave the die on a small island in the middle
-  -# If package cracks during this, should not be a problem
+    - If package cracks during this, should not be a problem
   - Combination of glue on carrier island to die being soft from heat and missing epoxy around die should allow die to separate from package with minimal epoxy attached
   - Turn off heat