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--- decap:laser [2023/09/04 07:43] – created mcmaster
+++ decap:laser [2025/01/30 03:43] (current) – mcmaster
@@ Line 2: / Line 2: @@
 TLDR: bulk material for standard packages can be removed using a fiber laser. However, a CO2 laser will not work (lower peak power => melts silica instead of ablating it). However the laser will damage the die surface if you try to go all the way to the surface (without using a special setup like FALIT). Finally, COB epoxy appears to be workable even with a CO2 laser
+Promising results: https://www.reddit.com/r/EngineeringPorn/comments/1icord2/comment/m9xy7ll/?context=3&share_id=i1YZrBEW-XINfaIcKmh4u&utm_content=1&utm_medium=ios_app&utm_name=ioscss&utm_source=share&utm_term=1
+  * What sort of laser did you use? How did you stop it from obliterating the die?
+  * Just a cheap laser off AliExpress. 3.5 watt 445nm output. Powerful enough to burn epoxy away (and the bond wires) but not powerful enough to burn silicon.
 General results
@@ Line 90: / Line 94: @@
 Basically this was too slow to be practical except for very small samples. That said, it did work very well. A quicklase or other higher throughput Nd:YAG system would likely work well
+===== mcmaster PLCC =====
+Remove bulk epoxy
+https://twitter.com/johndmcmaster/status/1641575200109244416
+https://www.youtube.com/watch?v=1V6UA4YQTM4
+https://www.youtube.com/watch?v=iGwrHPb_GvQ
 ===== Metal =====