decap:metal
Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
decap:metal [2012/07/21 23:00] – mcmaster | decap:metal [2016/12/03 20:53] (current) – mcmaster | ||
---|---|---|---|
Line 1: | Line 1: | ||
- | ====== Lid ====== | + | See also: [[decap: |
- | Professional labs use miniature can openers to avoid getting any fragments into the package since failure analysis may want to see if the device failed from particulates. | ||
- | http:// | + | ====== Lid ====== |
- | Ceramic-metal lids can also be removed with a torch. | + | ===== Can opener ===== |
+ | Professional labs use miniature can openers to avoid getting any fragments into the package since failure analysis may want to see if the device failed from particulates. | ||
- | ====== Die ====== | + | ===== Cutting |
- | Sometimes dies are soldered to a substrate (eg: silver heatsink / carrier). | + | While can openers |
- | {{: | ||
- | Note the raised corners. | + | ===== Thermal ===== |
+ | |||
+ | Ceramic-metal lids can also be removed with a torch. | ||
- | {{: | ||
- | Of course, it might take a while to get under the entire die. Heating without will help to get it off but I have found that it can take a lot of force to move even with solder melted and so its best to chemically remove as much silver as possible first. | + | ====== References ====== |
+ | * TO-3 Dremel: http:// | ||
decap/metal.1342911636.txt.gz · Last modified: 2013/10/20 14:59 (external edit)