Differences

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--- decap:metal [2012/07/22 01:14] – [Cutting] mcmaster
+++ decap:metal [2016/12/03 20:53] (current) – mcmaster
@@ Line 1: / Line 1: @@
+See also: [[decap:ceramic|Metal lid ceramic]]
 ====== Lid ======
-===== Can operner =====
+===== Can opener =====
 Professional labs use miniature can openers to avoid getting any fragments into the package since failure analysis may want to see if the device failed from particulates.
@@ Line 13: / Line 16: @@
 Ceramic-metal lids can also be removed with a torch.  However, it is easy to warp the ceramic package making it difficult to get a good image of the die.
-===== Laser =====
-[Ultratec] video shows a package being opened...not sure what type, but I'm assume metal as ceramic would be very hard to vaporize.
-====== Die ======
-Sometimes dies are soldered to a substrate (eg: silver heatsink / carrier).  Example after die was removed (by force):
-{{:decap:metal:silver_solder:corner.jpg?300|}}
-Note the raised corners.  This means that without completely melting the solder it is hard to get loose.  Soak in nitric acid and it should quickly dissolve and come loose:
-{{:decap:metal:silver_solder:hno3ed.jpg?300|}}
-Of course, it might take a while to get under the entire die.  Heating without will help to get it off but I have found that it can take a lot of force to move even with solder melted and so its best to chemically remove as much silver as possible first.
 ====== References ======
-  * Ultratec's "Decapsulation of ceramic packages": http://www.youtube.com/watch?v=IzlFw0Cz-Cw&feature=related
   * TO-3 Dremel: http://www.youtube.com/watch?v=lt_zFq4qzd0