Differences

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--- decap:solvent [2013/04/28 17:26] – mcmaster
+++ decap:solvent [2018/11/04 21:18] (current) – mcmaster
@@ Line 1: / Line 1: @@
-====== Dynaloy Dcap ======
+I tried decapping an MSP430 using both solvents and it didn't do a thing.  I did some research on epoxy chemistry, looks like this probably only works against a very limited number of epoxies.  Its nuclear how common these are.
+====== DMSO ======
+https://twitter.com/Zeptobars/status/1036864880857546753: "After 6 month testing my personal most promising solvent is DMSO. Will need to do more tests with heating and ultrasound to speed up the process."
+====== Dynaloy DYNASOLVE 711 ======
+{{:decap:solvnet:dynasolve_711.jpg?150|}}
+-06-14: When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
+===== 06/14/2004 MSDS =====
+^ Chemical ^ CAS ^ Weight % ^
+| 2-PROPANOL, 1-METHOXY | 107-98-2 | 40-60 |
+| 2-PROPANOL, 1-PHENOXY | 770-35-4 | 15-40 |
+| 2-PYRROLIDINONE, 1-METHYL- | 872-50-4 | 15-35 |
+| METHOL ALCOHOL | 67-56-1 | 2.5-10 |
+| POTASSIUM HYDROXIDE | 1310-58-3 | 1-5 |
+The KOH surprises me a little...maybe something else counteracts its effects on aluminum.
+====== Dynaloy Decap ======
+{{:decap:solvnet:dynasolve_decap.jpg?150|}}
 Advantages:
@@ Line 9: / Line 37: @@
   * Must be used hot (150C)
+IC package procedure [Dynaloy decap data sheet]:
-===== Instructions for IC package [Dynaloy decap data sheet] =====
-Do:
   - Pour into glass, stainless or aluminum beaker
   - Heat to 150C.  Do not heat further.  Boils at 189C, flash point at 95C
@@ Line 25: / Line 50: @@
-===== Content [Dynaloy decap MSDS] =====
+===== 02/17/2009 MSDS =====
+Comparing the datasheet I got in 2013 to the old datasheet I found online, it seems that they changed the product over time.  This datasheet lists the following content:
+^ Chemical ^ CAS ^ Weight % ^
+| METHANE, SULFINYLBIS- (1) | 67-68-5 | 60-90 |
+| 2-PROPANOL, 1-PHENOXY- | 770-35-4 | 10-30 |
+Evidently the first is DMSO...never heard that name before
+===== 04/01/1993 MSDS =====
+Content [Dynaloy decap MSDS]:
 ^ Chemical ^ CAS ^ Weight % ^
@@ Line 31: / Line 70: @@
 | METHYL SULFOXIDE, DIMETHYL SULFOXIDE | 67-68-5 | 80-90% |
 | PROPYLENE GLYCOL PHENYL ETHER | 770-35-4 | 7-20% |
+====== Resbond SSH13 ======
+This one might be only for non-molded epoxies (IE useless for IC work)
+^ Chemical ^ CAS ^ Weight % ^
+| Dichloromethane (DCM) | 75-09-2 | 75% |
+| Formic acid | 64-18-6 | 10% |
+| Phenol | 108-95-2 | 5% |
+====== 1,3-Dioxolane ======
+http://www.intermediates.basf.com/chemicals/web/en/content/products-and-industries/performance-materials/high-performance-solvents/dioxolane
+"Many applications of dioxolane are due to its ability to rapidly dissolve polar polymers, such as polyesters, epoxies and urethanes."
+====== Pyridine and DMSO ======
+[[https://twitter.com/pvachonnyc/status/1059130879052791808|Twitter]]: "Pyridine and DMSO, maybe 3:1 concentration, heated? [[https://patentimages.storage.googleapis.com/ee/f3/40/6fac51d4ddf2f0/US4729797.pdf|This IBM patent]] suggested it"
@@ Line 39: / Line 100: @@
   * Dynaloy decap data sheet]: http://www.dynaloy.com/images/stories/tech-briefs/Decap.pdf
   * Dynaloy decap purchase: http://www.ellsworth.com/dynaloy-decap-degreaser-and-cleaner-1qt-bottle/
+  * Resbond SSH13: http://www.final-materials.com/materiaux/produits/solvant-pour-resine-epoxy-172.html