Differences

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--- decap:solvent [2013/04/28 17:42] – [Dynaloy Dcap] mcmaster
+++ decap:solvent [2018/11/04 21:18] (current) – mcmaster
@@ Line 1: / Line 1: @@
-====== Dynaloy Dcap ======
+I tried decapping an MSP430 using both solvents and it didn't do a thing.  I did some research on epoxy chemistry, looks like this probably only works against a very limited number of epoxies.  Its nuclear how common these are.
+====== DMSO ======
+https://twitter.com/Zeptobars/status/1036864880857546753: "After 6 month testing my personal most promising solvent is DMSO. Will need to do more tests with heating and ultrasound to speed up the process."
+====== Dynaloy DYNASOLVE 711 ======
+{{:decap:solvnet:dynasolve_711.jpg?150|}}
+-06-14: When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
+===== 06/14/2004 MSDS =====
+^ Chemical ^ CAS ^ Weight % ^
+| 2-PROPANOL, 1-METHOXY | 107-98-2 | 40-60 |
+| 2-PROPANOL, 1-PHENOXY | 770-35-4 | 15-40 |
+| 2-PYRROLIDINONE, 1-METHYL- | 872-50-4 | 15-35 |
+| METHOL ALCOHOL | 67-56-1 | 2.5-10 |
+| POTASSIUM HYDROXIDE | 1310-58-3 | 1-5 |
+The KOH surprises me a little...maybe something else counteracts its effects on aluminum.
+====== Dynaloy Decap ======
+{{:decap:solvnet:dynasolve_decap.jpg?150|}}
 Advantages:
@@ Line 20: / Line 48: @@
   * Tarnishes silver and tinned leads
   * Use rubber or polyethylene gloves
+===== 02/17/2009 MSDS =====
+Comparing the datasheet I got in 2013 to the old datasheet I found online, it seems that they changed the product over time.  This datasheet lists the following content:
+^ Chemical ^ CAS ^ Weight % ^
+| METHANE, SULFINYLBIS- (1) | 67-68-5 | 60-90 |
+| 2-PROPANOL, 1-PHENOXY- | 770-35-4 | 10-30 |
+Evidently the first is DMSO...never heard that name before
+===== 04/01/1993 MSDS =====
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-===== Resbond SSH13 =====
+====== Resbond SSH13 ======
+This one might be only for non-molded epoxies (IE useless for IC work)
 ^ Chemical ^ CAS ^ Weight % ^
@@ Line 36: / Line 80: @@
 | Formic acid | 64-18-6 | 10% |
 | Phenol | 108-95-2 | 5% |
+====== 1,3-Dioxolane ======
+http://www.intermediates.basf.com/chemicals/web/en/content/products-and-industries/performance-materials/high-performance-solvents/dioxolane
+"Many applications of dioxolane are due to its ability to rapidly dissolve polar polymers, such as polyesters, epoxies and urethanes."
+====== Pyridine and DMSO ======
+[[https://twitter.com/pvachonnyc/status/1059130879052791808|Twitter]]: "Pyridine and DMSO, maybe 3:1 concentration, heated? [[https://patentimages.storage.googleapis.com/ee/f3/40/6fac51d4ddf2f0/US4729797.pdf|This IBM patent]] suggested it"
@@ Line 44: / Line 100: @@
   * Dynaloy decap data sheet]: http://www.dynaloy.com/images/stories/tech-briefs/Decap.pdf
   * Dynaloy decap purchase: http://www.ellsworth.com/dynaloy-decap-degreaser-and-cleaner-1qt-bottle/
+  * Resbond SSH13: http://www.final-materials.com/materiaux/produits/solvant-pour-resine-epoxy-172.html