Differences

This shows you the differences between two versions of the page.

--- decap:solvent [2013/05/04 23:12] – [Dynaloy DYNASOLVE 711 (06/14/2004)] mcmaster
+++ decap:solvent [2018/11/04 21:18] (current) – mcmaster
@@ Line 1: / Line 1: @@
-====== Dynaloy DYNASOLVE 711 (06/14/2004) ======
+I tried decapping an MSP430 using both solvents and it didn't do a thing.  I did some research on epoxy chemistry, looks like this probably only works against a very limited number of epoxies.  Its nuclear how common these are.
-When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
+====== DMSO ======
+https://twitter.com/Zeptobars/status/1036864880857546753: "After 6 month testing my personal most promising solvent is DMSO. Will need to do more tests with heating and ultrasound to speed up the process."
+====== Dynaloy DYNASOLVE 711 ======
+{{:decap:solvnet:dynasolve_711.jpg?150|}}
+-06-14: When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
+===== 06/14/2004 MSDS =====
 ^ Chemical ^ CAS ^ Weight % ^
@@ Line 12: / Line 24: @@
 The KOH surprises me a little...maybe something else counteracts its effects on aluminum.
-====== Dynaloy Decap (02/17/2009) ======
-Comparing the datasheet I got in 2013 to the old datasheet I found online, it seems that they changed the product over time.  This datasheet lists the following content:
+====== Dynaloy Decap ======
-^ Chemical ^ CAS ^ Weight % ^
+{{:decap:solvnet:dynasolve_decap.jpg?150|}}
-| METHANE, SULFINYLBIS- (1) | 67-68-5 | 60-90 |
-| 2-PROPANOL, 1-PHENOXY- | 770-35-4 | 10-30 |
-====== Dynaloy Decap (04/01/1993) ======
 Advantages:
@@ Line 42: / Line 48: @@
   * Tarnishes silver and tinned leads
   * Use rubber or polyethylene gloves
+===== 02/17/2009 MSDS =====
+Comparing the datasheet I got in 2013 to the old datasheet I found online, it seems that they changed the product over time.  This datasheet lists the following content:
+^ Chemical ^ CAS ^ Weight % ^
+| METHANE, SULFINYLBIS- (1) | 67-68-5 | 60-90 |
+| 2-PROPANOL, 1-PHENOXY- | 770-35-4 | 10-30 |
+Evidently the first is DMSO...never heard that name before
+===== 04/01/1993 MSDS =====
@@ Line 60: / Line 80: @@
 | Formic acid | 64-18-6 | 10% |
 | Phenol | 108-95-2 | 5% |
+====== 1,3-Dioxolane ======
+http://www.intermediates.basf.com/chemicals/web/en/content/products-and-industries/performance-materials/high-performance-solvents/dioxolane
+"Many applications of dioxolane are due to its ability to rapidly dissolve polar polymers, such as polyesters, epoxies and urethanes."
+====== Pyridine and DMSO ======
+[[https://twitter.com/pvachonnyc/status/1059130879052791808|Twitter]]: "Pyridine and DMSO, maybe 3:1 concentration, heated? [[https://patentimages.storage.googleapis.com/ee/f3/40/6fac51d4ddf2f0/US4729797.pdf|This IBM patent]] suggested it"