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--- decap:solvent [2018/09/04 01:38] – mcmaster
+++ decap:solvent [2018/11/04 21:18] (current) – mcmaster
@@ Line 1: / Line 1: @@
 I tried decapping an MSP430 using both solvents and it didn't do a thing.  I did some research on epoxy chemistry, looks like this probably only works against a very limited number of epoxies.  Its nuclear how common these are.
+====== DMSO ======
-====== Dynaloy DYNASOLVE 711 (06/14/2004) ======
+https://twitter.com/Zeptobars/status/1036864880857546753: "After 6 month testing my personal most promising solvent is DMSO. Will need to do more tests with heating and ultrasound to speed up the process."
+====== Dynaloy DYNASOLVE 711 ======
 {{:decap:solvnet:dynasolve_711.jpg?150|}}
-When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
+-06-14: When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation.  The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads).  It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
@@ Line 83: / Line 87: @@
 "Many applications of dioxolane are due to its ability to rapidly dissolve polar polymers, such as polyesters, epoxies and urethanes."
+====== Pyridine and DMSO ======
+[[https://twitter.com/pvachonnyc/status/1059130879052791808|Twitter]]: "Pyridine and DMSO, maybe 3:1 concentration, heated? [[https://patentimages.storage.googleapis.com/ee/f3/40/6fac51d4ddf2f0/US4729797.pdf|This IBM patent]] suggested it"