Differences

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--- decap:start [2012/03/02 07:35] – mcmaster
+++ decap:start [2018/09/20 16:22] (current) – [Misc] mcmaster
@@ Line 1: / Line 1: @@
+{{gallery>:mcmaster:cob.jpg}}
 Decapsulation is the process of removing a die from or exposing a die in a package.
-[[live_analysis|Live analysis considerations]]
 Depending on the carrier type, different techniques need to be used.
 ====== Epoxy ======
+{{mcmaster:decap:epoxy:trim:package_top.jpg?300}}
 [[epoxy|Main article]]
 In order to protect the fragile die, epoxy is mechanically strong and very chemical resistant. Strong chemicals, mechanical abrasion, or heat treatments can be used to remove epoxy. This is the most common packaging and possibly also the hardest.
 ====== Ceramic ======
+{{mcmaster:decap:glass_frit:quick_before.jpg?300}}
 [[ceramic|Main article]]
@@ Line 18: / Line 23: @@
 Fired ceramic with metal parts. Often sealed with glass and metal.
-====== Epoxy and metal ======
-[[epoxy_metal|Main article]]
-Hot running chips often require heat sinks and are integrated directly into the package.
 ====== Can ======
-[[can|Main article]]
+[[metal|See metal]]
 Some packages are fully metallic. Usually these are transistors, but military ICs also came (still do?) in these as well.
 ====== Plastic ======
@@ Line 36: / Line 38: @@
 Typically used for smart cards.
 ====== Misc ======
-[[misc|Main article]]
+https://events.ccc.de/congress/2014/Fahrplan/system/attachments/2512/original/Uncaging_Microchips-Marcus_Janke_Peter_Laackmann.pdf
+  * Covers misc decap ranging from crude mechanical to high end machines
+  * Peter Laackmann, Marcus Janke
-General hints
+https://www.researchgate.net/publication/225357700_Novel_Deprocessing_Technique_for_Failure_Analysis_of_Flip-Chip_Integrated_Circuit_Packages
+  * Novel Deprocessing Technique for Failure Analysis of Flip-Chip Integrated Circuit Packages