Differences

This shows you the differences between two versions of the page.

--- decap:start [2016/12/17 19:29] – mcmaster
+++ decap:start [2018/09/20 16:22] (current) – [Misc] mcmaster
@@ Line 7: / Line 7: @@
 ====== Epoxy ======
+{{mcmaster:decap:epoxy:trim:package_top.jpg?300}}
 [[epoxy|Main article]]
@@ Line 14: / Line 16: @@
 ====== Ceramic ======
+{{mcmaster:decap:glass_frit:quick_before.jpg?300}}
 [[ceramic|Main article]]
@@ Line 19: / Line 23: @@
 Fired ceramic with metal parts. Often sealed with glass and metal.
-====== Epoxy and metal ======
-[[epoxy_metal|Main article]]
-Hot running chips often require heat sinks and are integrated directly into the package.
@@ Line 39: / Line 37: @@
 Typically used for smart cards.
+====== Misc ======
+https://events.ccc.de/congress/2014/Fahrplan/system/attachments/2512/original/Uncaging_Microchips-Marcus_Janke_Peter_Laackmann.pdf
+  * Covers misc decap ranging from crude mechanical to high end machines
+  * Peter Laackmann, Marcus Janke
+https://www.researchgate.net/publication/225357700_Novel_Deprocessing_Technique_for_Failure_Analysis_of_Flip-Chip_Integrated_Circuit_Packages
+  * Novel Deprocessing Technique for Failure Analysis of Flip-Chip Integrated Circuit Packages