Differences

This shows you the differences between two versions of the page.

--- decap:start [2017/11/25 20:59] – [Epoxy] mcmaster
+++ decap:start [2018/09/20 16:22] (current) – [Misc] mcmaster
@@ Line 16: / Line 16: @@
 ====== Ceramic ======
+{{mcmaster:decap:glass_frit:quick_before.jpg?300}}
 [[ceramic|Main article]]
@@ Line 22: / Line 24: @@
-====== Epoxy and metal ======
-[[epoxy_metal|Main article]]
-Hot running chips often require heat sinks and are integrated directly into the package.
-Includes WDC PDIP package
 ====== Can ======
@@ Line 42: / Line 37: @@
 Typically used for smart cards.
+====== Misc ======
+https://events.ccc.de/congress/2014/Fahrplan/system/attachments/2512/original/Uncaging_Microchips-Marcus_Janke_Peter_Laackmann.pdf
+  * Covers misc decap ranging from crude mechanical to high end machines
+  * Peter Laackmann, Marcus Janke
+https://www.researchgate.net/publication/225357700_Novel_Deprocessing_Technique_for_Failure_Analysis_of_Flip-Chip_Integrated_Circuit_Packages
+  * Novel Deprocessing Technique for Failure Analysis of Flip-Chip Integrated Circuit Packages