Differences

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--- delayer:lapping [2018/09/20 16:18] – [References] mcmaster
+++ delayer:lapping [2019/06/26 14:18] (current) – [mcmaster notes] mcmaster
@@ Line 488: / Line 488: @@
 Slightly a step up is to use a machine without a jig.  Some notes: [[:tutorial:lapping|tutorial]]
+====== mcmaster notes ======
+g Al round block
+  * P180 / 80 um used SiC: 140 mm3 / sec @ speed 3
+    * 460 - 423 = 37 um / min
+    * 5.3 x 11.0 mm = 58.3 mm2
+    * 37 * 4 * 58.3 = 8628.4 mm3 / min
+    * One die fractured after just one minute
+    * Probably too aggressive to use in practice
+  * 30 um new AO: 6.2 mm3 / sec @ speed 3
+    * Same area as above
+    * 1.6 um / min
+    * 1.6 * 4 * 58.3 = 373 mm3 / min
+Removing pads
+  * 300 F optimal
+  * By 350F glue is too soft to come off in one piece
 ====== References ======
@@ Line 503: / Line 521: @@
     * [[https://www.youtube.com/watch?v=OP6LP7oALTU|Chemical Mechanical Planarization, CMP Process Fundamentals: Sec. 5 & 6 - CMP Challenges & Summary]]
   * https://www.rawscience.co.uk/pdf/single-die-hands-free-layer-by-layer-mechanical-deprocessing-for-failure-analysis-or-reverse-engineering.pdf
+    * Single Die 'Hands-Free' Layer-by-Layer Mechanical Deprocessing for Failure Analysis or Reverse Engineering
+    * Tony Moor, with support from Gatan (Eli Malyanker, Efrat Raz-Moyal)
     * Talks about sacrificial dies and other issues
     * Professional equipment