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invasive [2012/06/23 22:29] – [References] mcmasterinvasive [2018/02/25 09:10] (current) – mcmaster
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 ====== Backside analysis ====== ====== Backside analysis ======
  
-Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal.  [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.+[[backside:start]]
  
 ====== Rewiring ====== ====== Rewiring ======
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 ==== FIB ==== ==== FIB ====
  
-The "professional" high end solution used for small processes.  Equipment is rather expensive. (how much?)+The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD. 
 + 
 +FIB time can often be rented on an hourly basis from universities and research labs. 
 + 
 +azonenberg is beginning to experiment with FIB. [[azonenberg:fibnotes|Lab notes]] 
  
 ==== Scratching ==== ==== Scratching ====
  
-Microprobes can cut traces by moving back and forth.  Professional units use ultrasound.+Microprobes can cut traces by moving back and forth.  Professional units use peizo's (ie ultrasound). 
  
 ==== Chemical ==== ==== Chemical ====
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 Usually done with a fib.  Can be done temporarily with microprobes or possibly on a high process chip very carefully with conductive epoxy. Usually done with a fib.  Can be done temporarily with microprobes or possibly on a high process chip very carefully with conductive epoxy.
 +
 +
 +====== Presentation: low cost microporbing ======
 +
 +JM's highlights from watching the presentation
 +
 +exposing wires
 +  * laser
 +    * expensive
 +    * more reliable with experience
 +    * better option for smaller areas
 +    * better option for planar chips
 +  * scratching
 +    * good option for larger, non-planar chips
 +    * lower cost
 +fuses
 +  * binary search by covering chip
 +    * try to erase with UV light
 +  * trace VPP
 +    * charge pump or external
 +  * confirm guess via microprobing
 +op amp vs ttl amp for gain
 +  * microcircuits damaged or distorted when disturbed
 +  * op amp in volt follower mode
 +    * "more transparent electrically"
 +    * look at noise level
 +      * drops when makes contact
 +      * not necessarily the right wire though
 +fib probing
 +  * shoots ions instead of electrons
 +  * filled hole with platinum to make a bond pad
 +anti-anti-re
 +  * cut charge pumps
 +  * jump security mesh
 +  * go from back side
 +    * challenge: can destablize chips
 +    * tends to be used more by FA than RE
 +  * peizo probing
 +    * they didn't like it
 +    * I've seen others use it
 +future/upcoming anti-re
 +  * analog meshes
 +    * The IBM PCI card thing has one externally but maybe not plausible yet at chip level
 +
 +No mention of masked etching.  Ex: putting PR or nail polish and etching with HF
  
 ====== References ====== ====== References ======
  
   * Functional IC Analysis: http://nedos.net/host2012.pdf   * Functional IC Analysis: http://nedos.net/host2012.pdf
 +  * Breaking and Entering through the Silicon: http://nedos.net/ccs2013.pdf
 +  * Low-Cost Chip Microprobing
 +    * http://events.ccc.de/congress/2012/Fahrplan/events/5124.en.html
 +    * http://media.ccc.de/browse/congress/2012/29c3-5124-en-low_cost_chip_microprobing_h264.html
  
  
invasive.1340490552.txt.gz · Last modified: 2013/10/20 14:59 (external edit)