Differences

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--- invasive [2013/01/19 07:00] – mcmaster
+++ invasive [2018/02/25 09:10] (current) – mcmaster
@@ Line 3: / Line 3: @@
 ====== Backside analysis ======
-Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal.  [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.
+[[backside:start]]
 ====== Rewiring ======
@@ Line 15: / Line 15: @@
 ==== FIB ====
-The "professional" high end solution used for small processes.  Equipment is rather expensive. (how much?)
+The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD.
+FIB time can often be rented on an hourly basis from universities and research labs.
+azonenberg is beginning to experiment with FIB. [[azonenberg:fibnotes|Lab notes]]
@@ Line 33: / Line 37: @@
-===== Presentation: low cost microporbing =====
+====== Presentation: low cost microporbing ======
 JM's highlights from watching the presentation
@@ Line 56: / Line 60: @@
   * op amp in volt follower mode
     * "more transparent electrically"
-  * look at noise level
+    * look at noise level
-    * drops when makes contact
+      * drops when makes contact
-    * not necessarily the right wire though
+      * not necessarily the right wire though
 fib probing
   * shoots ions instead of electrons
@@ Line 75: / Line 79: @@
     * The IBM PCI card thing has one externally but maybe not plausible yet at chip level
+No mention of masked etching.  Ex: putting PR or nail polish and etching with HF
 ====== References ======
   * Functional IC Analysis: http://nedos.net/host2012.pdf
+  * Breaking and Entering through the Silicon: http://nedos.net/ccs2013.pdf
   * Low-Cost Chip Microprobing
     * http://events.ccc.de/congress/2012/Fahrplan/events/5124.en.html