Silicon Pr0n

User Tools

Site Tools

Trace:
invasive

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
Next revision		Previous revision
invasive [2013/01/19 17:54] – [FIB] mcmasterinvasive [2018/02/25 09:10] (current) – mcmaster
Line 3: Line 3:
 ====== Backside analysis ====== ====== Backside analysis ======
  
-Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal.  [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.+[[backside:start]]
  
 ====== Rewiring ====== ====== Rewiring ======
Line 16: Line 16:
  
 The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD. The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD.
 +
 +FIB time can often be rented on an hourly basis from universities and research labs.
 +
 +azonenberg is beginning to experiment with FIB. [[azonenberg:fibnotes|Lab notes]]
 +
  
 ==== Scratching ==== ==== Scratching ====
Line 79: Line 84:
  
   * Functional IC Analysis: http://nedos.net/host2012.pdf   * Functional IC Analysis: http://nedos.net/host2012.pdf
 +  * Breaking and Entering through the Silicon: http://nedos.net/ccs2013.pdf
   * Low-Cost Chip Microprobing   * Low-Cost Chip Microprobing
     * http://events.ccc.de/congress/2012/Fahrplan/events/5124.en.html     * http://events.ccc.de/congress/2012/Fahrplan/events/5124.en.html
invasive.1358618070.txt.gz · Last modified: 2013/10/20 14:59 (external edit)