Differences

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--- invasive [2014/01/01 06:16] – mcmaster
+++ invasive [2018/02/25 09:10] (current) – mcmaster
@@ Line 3: / Line 3: @@
 ====== Backside analysis ======
-Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal.  [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.
+[[backside:start]]
-Sample preparation example: http://jiam.utk.edu/new/PDF/Allied-Backside-Thinning.pdf
 ====== Rewiring ======
@@ Line 19: / Line 16: @@
 The "professional" high end solution used for small processes.  Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD.
+FIB time can often be rented on an hourly basis from universities and research labs.
+azonenberg is beginning to experiment with FIB. [[azonenberg:fibnotes|Lab notes]]
 ==== Scratching ====