Differences

This shows you the differences between two versions of the page.

--- misc [2012/06/22 05:43] – mcmaster
+++ misc [2021/09/18 20:36] (current) – mcmaster
@@ Line 1: / Line 1: @@
 Misc topics:
+  * [[glossary]]
+  * [[carrier:marking|Marking]]: package marking
   * [[carrier|Carrier structure]]: how carriers are made
   * [[carrier:start|Carriers]]: types of carriers
-  * [[cleaning|Cleaning]]: cleaning and contamination control
   * [[forgery|Forgery]]: clones, phonies, etc
   * [[process_tech|Process technology]]: identifying the process an IC was made with
@@ Line 9: / Line 10: @@
   * [[manufacture|Manufacture]]: how are chips made anyways
   * [[resources|Resources]]: misc resources and references
+  * [[routing|Routing]]: power and signal routing techniques
   * [[sabotage|Sabotage]]: playing dirty
   * [[obscurification]]: confusing attackers
-  * [[physical protection]]
   * [[Determining pinout]]
+  * [[side_channel|Side channel attacks]]
   * [[true mask art]]: silicon doodles
   * [[vlsi_design]]: knowing how to build can help take apart
   * [[Designing vs reversing]]
+  * [[dfm|Design for manufacturing]]: related to yield, price, etc
+  * [[glove]]
+Identifying counterfeit ICs: http://www.cti-us.com/pdf/CCAP-101InspectExamplesA6.pdf