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Table of Contents
Dynaloy DYNASOLVE 711 (06/14/2004)
When I talked to a sales rep he said that most people use this over Dynaloy Decap these days for IC decapsulation. The main advantage is that it is supposed to be much nicer to aluminum (ie bond pads). It doesn't explicitly list IC decapsulation on the datasheet so I didn't consider ordering it.
| Chemical | CAS | Weight % |
|---|---|---|
| 2-PROPANOL, 1-METHOXY | 107-98-2 | 40-60 |
| 2-PROPANOL, 1-PHENOXY | 770-35-4 | 15-40 |
| 2-PYRROLIDINONE, 1-METHYL- | 872-50-4 | 15-35 |
| METHOL ALCOHOL | 67-56-1 | 2.5-10 |
| POTASSIUM HYDROXIDE | 1310-58-3 | 1-5 |
The KOH surprises me a little…maybe something else counteracts its effects on aluminum.
Dynaloy Decap (02/17/2009)
Comparing the datasheet I got in 2013 to the old datasheet I found online, it seems that they changed the product over time. This datasheet lists the following content:
| Chemical | CAS | Weight % |
|---|---|---|
| METHANE, SULFINYLBIS- (1) | 67-68-5 | 60-90 |
| 2-PROPANOL, 1-PHENOXY- | 770-35-4 | 10-30 |
Dynaloy Decap (04/01/1993)
Advantages:
- Acid free decap (gentle on metals?)
- Datasheet claims it flakes, not swells. If so this makes it superior to swell epoxy removers which can damage bond wires
- Does not eat aluminum (or one should hope anyway since they say its fine to heat in an aluminum container…)
Disadvantages
- Expensive compared to simple acids (Ellsworth sells it from about $184-131 / quart)
- Must be used hot (150C)
IC package procedure [Dynaloy decap data sheet]:
- Pour into glass, stainless or aluminum beaker
- Heat to 150C. Do not heat further. Boils at 189C, flash point at 95C
- Use metal tongs to remove sample
- Wash sample with water, IPA, or MEK to remove Decap
Notes:
- To reuse: filter it
- Store above 70F as will crystalize below 60F. If so just re-heat
- Tarnishes silver and tinned leads
- Use rubber or polyethylene gloves
Content [Dynaloy decap MSDS]:
| Chemical | CAS | Weight % |
|---|---|---|
| AMYL ACETATE | 628-63-7 | 1-3% |
| METHYL SULFOXIDE, DIMETHYL SULFOXIDE | 67-68-5 | 80-90% |
| PROPYLENE GLYCOL PHENYL ETHER | 770-35-4 | 7-20% |
Resbond SSH13
This one might be only for non-molded epoxies (IE useless for IC work)
| Chemical | CAS | Weight % |
|---|---|---|
| Dichloromethane (DCM) | 75-09-2 | 75% |
| Formic acid | 64-18-6 | 10% |
| Phenol | 108-95-2 | 5% |
References
- Dynaloy products: http://www.dynaloy.com/Products/epoxy_products.html
- Dynaloy decap MSDS: http://hazard.com/msds/f2/chm/chmhj.html
- Dynaloy decap data sheet]: http://www.dynaloy.com/images/stories/tech-briefs/Decap.pdf
- Dynaloy decap purchase: http://www.ellsworth.com/dynaloy-decap-degreaser-and-cleaner-1qt-bottle/