Package

Markings:

  hynix KOR
  HY27US08561M
  TPEB 507B
  
  M9RB1508?

Last line is in a different font. Firmware revision code maybe?

Die

Size is large (not measured, full images not acquired yet)

Overview of bottom part of die

Closeup of die ID markings

Various parts of memory array (images do not overlap)

Various closeups

Random logic at bottom center of chip. Lots of CMP filler (?)