azonenberg:xilinx:xc3s50a
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Table of Contents
See also: xc3s50a
Package
No shot available right now :(
Known to be die rev A.
Die
Size is approximately 3200 x 2850 μm (9.12 mm2)
M8 with intact passivation
M8 with passivation removed
M7
M6 and below could not be revealed cleanly with HF etching, need to CMP another die.
Active
Might be some poly too.
Left side of block RAM
Gap between two groups of CLBs
azonenberg/xilinx/xc3s50a.1398571366.txt.gz · Last modified: 2014/04/27 04:02 by azonenberg