Trace: • xc3s50a

Table of Contents

Package
Die

collection az, vendor xilinx, year 2006, type logic, type logic/programmable, type logic/programmable/fpga, foundry ibm, foundry umc, tech 90nm

See also: xc3s50a

Package

No shot available right now :(

Known to be die rev A.

Die

Size is approximately 3200 x 2850 μm (9.12 mm²)

M8 with intact passivation

M8 with passivation removed

M7

M6 and below could not be revealed cleanly with HF etching, need to CMP another die.

Active

Might be some poly too.

Left side of block RAM

Gap between two groups of CLBs

azonenberg/xilinx/xc3s50a.txt · Last modified: 2015/01/04 22:50 (external edit)

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