Trace: • w25q80bv

Table of Contents

Package
Die
Map

collection az, vendor winbond, year 2008, type memory, type memory/flash, type memory/flash/nor, foundry unknown, tech unknown

1MB SPI flash

Package

Die

Die size is approximately 1590 x 1920 μm (3.0 mm²)

Map

http://siliconpr0n.org/map/winbond/w25q80bv/mz_bf_neo10x/

azonenberg/winbond/w25q80bv.txt · Last modified: 2015/01/04 22:50 (external edit)

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