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| Both sides previous revisionPrevious revisionNext revision | Previous revisionNext revisionBoth sides next revision | ||
| carrier [2013/05/01 05:14] – [Resin mould] mcmaster | carrier [2013/05/01 05:29] – [Leadframe] mcmaster | ||
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| The center portion is called by many names. | The center portion is called by many names. | ||
| * Paddle (as found in [[http:// | * Paddle (as found in [[http:// | ||
| + | * Die mounting paddle [Plastic MEMS 68] | ||
| * Carrier island (eg by Beck's failure analysis) | * Carrier island (eg by Beck's failure analysis) | ||
| * Mounting surface (as found in [[http:// | * Mounting surface (as found in [[http:// | ||
| Line 26: | Line 27: | ||
| As Beck's failure analysis is a well written published work I originally referred to it as a " | As Beck's failure analysis is a well written published work I originally referred to it as a " | ||
| + | |||
| + | [[carrier: | ||
| + | |||
| ====== Bonding wire ====== | ====== Bonding wire ====== | ||
| Line 35: | Line 39: | ||
| [[carrier: | [[carrier: | ||
| + | ====== References ====== | ||
| + | * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http:// | ||