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| manufacture [2012/08/13 06:49] – [Wafer testing] mcmaster | manufacture [2012/08/13 07:02] – [Wafer testing] mcmaster | ||
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| Some circuits can undergo basic testing.by using test pads when still in the wafer. This eliminates the following steps only to find the entire wafer was bad. If too many units are bad during initial testing, the whole process is typically aborted. | Some circuits can undergo basic testing.by using test pads when still in the wafer. This eliminates the following steps only to find the entire wafer was bad. If too many units are bad during initial testing, the whole process is typically aborted. | ||
| - | FIXME: get a picture of a probe card | + | FIXME: get a picture of a probe card (off of my phone...) |
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| + | FIXME: add probe scrube marks | ||
| ====== Dicing ====== | ====== Dicing ====== | ||