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process_tech [2013/06/26 04:37] mcmasterprocess_tech [2013/06/26 05:25] mcmaster
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 ====== Typical layer dimensions ====== ====== Typical layer dimensions ======
 +
 +This section prepared initially to better understand typical layer thickness to understand how to improve wet etching processes and to better understand limitations of lapping.
 +
  
 ===== Bipolar ===== ===== Bipolar =====
Line 102: Line 105:
  
 ===== CMOS ===== ===== CMOS =====
 +
 +Samsung KM44C4000J-7 16 Megabit DRAM, Report Number: SCA 9311-300I vertical dimensions:
 +  * Die thickness: 0.3 mm
 +  * Die coat: 9.5 um
 +    * Die coat: "A patterned (to clear bond pads) polyimide die coat was present to protect against alpha particle-induced leakage. Coverage was good."
 +  * Passivation 3: 0.55 um
 +  * Passivation 2: 0.3 um
 +  * Passivation 1: 0.1 um
 +  * M2 (Al): 0.9 um
 +  * Glass 3 ILD: 0.4 um
 +  * Glass 2 ILD: 0.4 um
 +  * Glass 1 ILD: ~0.08 um
 +  * M1 cap: 0.04 um
 +  * M1 (Al): 0.55 um
 +  * M1 barrier: 0.15 um
 +  * Intermediate glass 2: 0.5 um
 +  * Polycide-silicide: 0.2 um
 +  * Polycide-silicide poly 4: ~0.05 um
 +  * Intermediate glass 1: 0.2 um
 +  * Oxide on poly 3: 0.1 um
 +  * Poly 3: 0.1 um
 +  * Capacitor dielectric: ~0.015 um
 +  * Poly 2: 0.15 um
 +  * Interpoly oxide total: 0.35 um
 +  * Interpoly oxide nitride: ~0.04 um
 +  * Poly 1: 0.2 um
 +  * Local oxide (under poly 1): 0.3 um
 +  * Oxide on N+: ~0.08 um
 +  * Oxide on P+: ~0.06 um
 +  * N+ source/drain: 0.2 um
 +  * P+ source/drain: 0.3 um
 +  * (likely) N-well: 4.5 um
 +
  
 [Interconnect Scaling] says that ITRS '99 "dictated dimensions" for the '99 technology node are: [Interconnect Scaling] says that ITRS '99 "dictated dimensions" for the '99 technology node are:
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   * 0.8 um process   * 0.8 um process
   * Intended use: maybe RF ICs   * Intended use: maybe RF ICs
-  * Inter-Metal Dielectric (IMD): 1.1 um+  * Inter-Metal Dielectric (IMD) thickness: 1.1 um
   * Metal thickness: 2.1 um or 2.1 um   * Metal thickness: 2.1 um or 2.1 um
  
 
process_tech.txt · Last modified: 2015/12/17 22:52 by azonenberg
 
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