carrier:th
Differences
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carrier:th [2013/10/28 14:21] – mcmaster | carrier:th [2013/10/28 14:22] (current) – mcmaster | ||
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Slight variation with the grounding strap soldered directly to the lid: | Slight variation with the grounding strap soldered directly to the lid: | ||
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An unusual package with pins to stack another chip on top (for EPROM for the MCU IIRC in this case): | An unusual package with pins to stack another chip on top (for EPROM for the MCU IIRC in this case): | ||
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An unusual package with a lid covering the entire top: | An unusual package with a lid covering the entire top: | ||
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carrier/th.1382970072.txt.gz · Last modified: 2013/10/28 14:21 by mcmaster