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--- layer [2013/06/26 04:22] – created mcmaster
+++ layer [2013/06/26 04:26] (current) – removed mcmaster
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-ICs are made of many layers.  The specific number varies greatly depending on the "process technology" used (that is the feature size, features, etc).
-====== Bipolar ======
-====== NMOS/PMOS ======
-====== CMOS ======
-===== Thick metal process =====
-Looks like its intended for RF ICs.  Sample dimensions for 0.8 um process [Thick Metal]:
-  * Inter-Metal Dielectric (IMD): 1.1 um
-  * Metal thickness: 2.1 um or 2.1 um
-====== BiCMOS ======
-====== Referneces ======
-  * Thick Metal CMOS Technology on High Resistivity Substrate and Its Application to Monolithic L-Band CMOS LNAs ("Thick Metal", aka we luv long titles): http://etrij.etri.re.kr/pdfdata/21-04-01.pdf