Differences

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--- tutorial:mcu_security [2018/05/04 07:53] – created mcmaster
+++ tutorial:mcu_security [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 44: / Line 44: @@
 ===== 8751 =====
-[[http://siliconpr0n.org/map/intel/d8751h/mz_mit20x/|Die photo]]
+[[http://siliconprawn.org/map/intel/d8751h/mz_mit20x/|Die photo]]
 Bond wires: usually aluminum
@@ Line 57: / Line 57: @@
 ===== Microchip PIC16C57 =====
-[[https://siliconpr0n.org/map/microchip/pic16c57/mz_mit20x/|Die photo]]
+[[https://siliconprawn.org/map/microchip/pic16c57/mz_mit20x/|Die photo]]
 PDIP bond wires: gold
@@ Line 221: / Line 221: @@
 Solutions
   * [[http://caps0ff.blogspot.com/2018/02/decap-c016-gms-mj-dfmj-pic16f84.html|PIC16F84]]
-  * [[http://siliconpr0n.org/media/mtvre/2016-01-13_john_m_silicon_photonics.pdf|87C51]]
+  * [[http://siliconprawn.org/media/mtvre/2016-01-13_john_m_silicon_photonics.pdf|87C51]]
 ===== U3L2: dynamic glitch =====