Differences

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--- bonding:rebond [2015/12/09 20:52] – azonenberg
+++ bonding:rebond [2019/03/05 00:16] (current) – removed mcmaster
@@ Line 1: / Line 1: @@
-It is often necessary to re-bond a bare die. Typical reasons include:
-  * Original bond wires were accidentally destroyed during decap
-  * Device was obtained as a bare die from a third party
-  * FIB edit could not be done with device in package due to mechanical constraints
-FIXME: Has anyone tried wirebonding to FIBbed pads?
-Several firms sell refurbished wire bonders and provide service, support, and parts. Some of these companies will also do custom bonding projects for single dies or small lots.
-====== Surface preparation ======
-If any existing bonds, or pieces of them, are still on the pads these must be [[bonding:removal|removed]] first.
-Pads should be [[cleaning|clean]] and undamaged.
-FIXME: Get a photo of a nice clean pad that copper bond wire was etched off of
-====== Mounting ======
-The die must be secured firmly to its new package to keep it from moving around. AZ has had good experiences using a tiny dot of cyanoacrylate adhesive, although epoxy or Crystalbond would likely work fine as well.
-FIXME: Get a photo here
-====== Re-bonding ======
-Bonding to a clean, once-bonded pad should be essentially the same as bonding to a never-bonded pad. Contact resistance may be a little higher and reliability reduced, but this isn't a big concern if you just want to dump the firmware.