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| carrier [2013/05/01 05:29] – mcmaster | carrier [2015/12/17 23:30] (current) – [Bonding wire] azonenberg | ||
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| The center portion is called by many names. | The center portion is called by many names. | ||
| - | * Paddle (as found in [[http:// | + | * Paddle (as found in [[http:// |
| + | * Die mounting paddle [Plastic MEMS 68] | ||
| * Carrier island (eg by Beck's failure analysis) | * Carrier island (eg by Beck's failure analysis) | ||
| * Mounting surface (as found in [[http:// | * Mounting surface (as found in [[http:// | ||
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| ====== Bonding wire ====== | ====== Bonding wire ====== | ||
| - | Thin, usually gold, wires to electrically connect the leadframe to the die. They are typically welded die or connected via conductive epoxy. Connection to the leadframe is probably welded, need some evidence though. | + | Thin, usually gold, wires to electrically connect the leadframe to the die. For more details see the article on [[bonding: |
| ====== Types ====== | ====== Types ====== | ||