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| components [2012/02/20 09:29] – created mcmaster | components [2012/03/18 10:16] – azonenberg | ||
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| It is very fragile and can easily get completely stripped during decapsulation. | It is very fragile and can easily get completely stripped during decapsulation. | ||
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| Does not seem that this is common and is only seen in very high performance ICs. | Does not seem that this is common and is only seen in very high performance ICs. | ||
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| - | ====== Bonding ====== | ||
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| - | Bonding is the process of connecting bond wires to bond pads. | ||
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| - | ====== Ball bond ====== | ||
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| - | This is the most common and cost effective method for general use on modern ICs. It works by using electricity to spot weld the wire to the pad and may also rely on pressure, ultrasound, and heat. | ||
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| - | ====== Wedge bond ====== | ||
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| - | {{gallery> | ||
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| - | This uses only ultrasound, pressure, and heat to connect bond wires to ICs as opposed to ball bonding which also uses electric current. As it is slower than ball bonding, it is only used now for special high speed applications. However, it is common in older ICs. | ||
| ====== Test structures ([[Test structures|main article]]) ====== | ====== Test structures ([[Test structures|main article]]) ====== | ||