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| decap:ceramic [2019/12/17 03:05] – Mu mcmaster | decap:ceramic [2020/03/30 00:46] – mcmaster | ||
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| ===== Bandsaw ===== | ===== Bandsaw ===== | ||
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| + | Above: fixturing for cutting. Sample held in DIP 40 ZIF. Use cross slide to stablize. | ||
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| * Saw a slit on both sides of the cavity | * Saw a slit on both sides of the cavity | ||
| * As far as possible, usually about 0.1" after the quartz window | * As far as possible, usually about 0.1" after the quartz window | ||
| + | * Saw just into the glass frit | ||
| + | * WARNING: failing to completely separate ceramic can lead to unpredictable breakage | ||
| * Should be roughly above where the bond wires attach but not above the die | * Should be roughly above where the bond wires attach but not above the die | ||
| * Small debris in the cavity is normal and shouldn' | * Small debris in the cavity is normal and shouldn' | ||
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| Grinding: | Grinding: | ||
| + | * Grinding was used more initially, but can be slower (especially for large packages) and may have increased change to damage die | ||
| + | * Alternate side of blade used to prolong blade life | ||
| * Slowly side grind and/or cut across the whole cavity | * Slowly side grind and/or cut across the whole cavity | ||
| * Cut about halfway through the top ceramic | * Cut about halfway through the top ceramic | ||
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| * Try to make one continuous cut | * Try to make one continuous cut | ||
| * Multiple cuts increase change to fragment and create larger debris | * Multiple cuts increase change to fragment and create larger debris | ||
| + | * Wash nail polish away with acetone | ||
| + | * See UV masking page for more info | ||
| ===== Thermal fracture (old) ===== | ===== Thermal fracture (old) ===== | ||