Differences

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--- pad [2012/06/21 05:40] – created mcmaster
+++ pad [2012/07/07 02:37] – azonenberg
@@ Line 5: / Line 5: @@
 Still has a bond wire on it:
 {{gallery>image:overglass_1.jpg}}
+Hole left by a bond wire being forcibly pulled off:
+{{:bond:bond_pad_01_neo20_cropped.jpg?300|}}
+Empty pad (never bonded). Note scratches left by probe needle during wafer test. This is //not// damage from a pulled bond wire.
+{{::bond:probe_scrub_01_neo20x_cropped.jpg?300|}}
 Damaged overglass:
@@ Line 10: / Line 19: @@
 It is very fragile and can easily get completely stripped during decapsulation.
-Aluminium (M1) errosion from excessive time in acid bath:
+Aluminum (M1) erosion from excessive time in acid bath:
 {{gallery>image:overglass_acid_seep.jpg}}