This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revisionNext revision | Previous revisionLast revisionBoth sides next revision | ||
tutorial:start [2017/10/25 03:50] – [External] mcmaster | tutorial:start [2018/05/04 07:53] – mcmaster | ||
---|---|---|---|
Line 1: | Line 1: | ||
This page is an index of articles describing procedures in detail, illustrated by photos from contributors' | This page is an index of articles describing procedures in detail, illustrated by photos from contributors' | ||
+ | |||
+ | [[mcu_security|MCU security series]] | ||
+ | |||
====== Decapsulation ====== | ====== Decapsulation ====== | ||
Line 6: | Line 9: | ||
* [[Tutorial on epoxy decapsulation|Epoxy decapsulation for live analysis]] | * [[Tutorial on epoxy decapsulation|Epoxy decapsulation for live analysis]] | ||
* Heated 70% nitric acid + dropper | * Heated 70% nitric acid + dropper | ||
- | * [[Tutorial on funneled 70% nitric acid epoxy decapsulation for live analysis using|Epoxy decapsulation for live analysis]] | ||
- | * Heated 70% nitric acid + funnel | ||
* [[Tutorial on silver plated copper decapsulation|Silver plated copper decapsulation]] | * [[Tutorial on silver plated copper decapsulation|Silver plated copper decapsulation]] | ||
* Isolate the epoxy covered die from the majority carrier | * Isolate the epoxy covered die from the majority carrier |