Differences

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--- carrier:epoxy [2013/05/05 05:00] – [Vendor epoxies] mcmaster
+++ carrier:epoxy [2013/10/20 14:59] (current) – external edit 127.0.0.1
@@ Line 20: / Line 20: @@
   * DDM: 4,4 ́ Diaminodiphenyl methane
   * DDS: 4,4 ́ Diaminodiphenyl sulfone
-  * DETDA: Diethyl toluene diamine
+  * DETDA: Diethyl toluene diamine, CAS 68479-98-1
-  * DGEBA: Diglycidyl ether of bisphenol A
+  * DGEBA: Diglycidyl ether of bisphenol A, CAS 1675-54-3
-  * TETA: Triethylene tetramine Dioctyl phthalate Diglycidylether of 1,4 butane
+  * TETA: Triethylene tetramine Dioctyl phthalate Diglycidylether of 1,4 butane, CAS 112-24-3
-  * TGAP: Triglycidyl p-amino phenol
+  * TGAP: Triglycidyl p-amino phenol, CAS 5026-74-4
   * TGDDM: Tetraglycidylether of 4,4′ diaminodiphenyl methane
@@ Line 48: / Line 48: @@
 | DMC 2000HG | 175 | 26 |
-===== Additives =====
+===== Composition =====
 Many thermoset epoxies contain bromine for flame retardation [Thermoplastics for Packaging 3].
+The following have been observed:
+  * Epoxy resin
+    * The specific contents are almost always omitted
+    * Seen "Brominated epoxy resin"
+  * Phenol resin
+    * The specific contents are almost always omitted, sometimes see "Phenol novolac"
+  * Fused silica
+  * Antimony trioxide
+  * Carbon black
+  * Crystalline silica
+  * Metal hydroxide
+    * Specific contents always omitted
@@ Line 62: / Line 75: @@
   * DongJin DMC 2000HG [PCN0702]
   * Hysol MG97-8006A [Hana BOM]
-    * Optically clear?  Might not be transfer molded
+    * Optically clear...might not be transfer molded
   * Nitto MP8000AN [Hana BOM]
   * Nitto MP8000CH [Hana BOM]
@@ Line 90: / Line 103: @@
 [Hitachi EMCs] lists more Tg in about the same range
+[SI chapter 3] shows "BT Resin Glass Epoxy" as the substrate for "OMPAC Ball Grid Array From Motorola"
@@ Line 113: / Line 128: @@
 | Metal hydroxide | N/A | 1-10 |
 | Other | N/A | <= 0.5 |
+===== Sumikon EME-6600CS =====
+[Sumikon EME-6600CS]
+^ Name ^ CAS ^ Mass % ^
+| Fused silica | 60676-86-0 | 70-90 |
+| Epoxy resin | N/A | 8-12 |
+| Phenol novolac | 9003-35-4 | 4-7 |
+| Antimony trioxide | 1309-64-4 | 1-3 |
+| Brominated epoxy resin | 68541-56-0 | 1.6-3.5 |
+| Carbon black | 1333-86-4 | 0.1-0.5 |
+===== Hitachi CEL-9200 =====
+[Hitachi CEL-9200]
+^ Name ^ CAS ^ Mass % ^
+| Epoxy resin | 85954-11-6 | 4-6 |
+| Phenol resin | 26834-02-6 | 4-6 |
+| Brominated epoxy resin | 68541-56-0 | 1 |
+| Antimony trioxide | 1309-64-4 | 0.5 |
+| Silica | 60676-86-0 | 87-90 |
+| Others | N/A | 1 |
+===== Sumikon EME-6710SJ =====
+^ Name ^ CAS ^ Mass % ^
+| Silica fused | 60676-86-0 | 60-90 |
+| Epoxy, cresol novolac | 29690-82-2 | 5-15 |
+| Phenol novolac | 9003-35-4 | 3-10 |
+| Antimony trioxide | 1309-64-4 | 1-5 |
+| Brominated epoxy resin | 68541-56-0 | 1-3 |
+| Carbon black | 1333-86-4 | 0.1-0.5 |
+Epoxy is Poly[(o-cresyl glycidyl ether)-co-formaldehyde]
@@ Line 145: / Line 199: @@
   * Hitachi EMCs: http://www.hitachi-chem.co.jp/english/products/srm/012.html
   * ON PCN 16118: http://www.onsemi.com/pub/docs/pcn/FPCN16118.pdf
+  * SI chapter 3: http://smithsonianchips.si.edu/ice/cd/BT/SECTION3.PDF
+  * http://www.maximintegrated.com/emmi/msds.cfm
+  * Sumikon EME-6600CS: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME-6600CS_08-28-2002_R01-25-2008.pdf
+  * Hitachi CEL-9200: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_HITACHI_CEL9200-SERIES_02-19-1997_R10-31-2007.pdf
+  * Sumikon EME-6710SJ: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME6710SJ_09-03-2002_R09-28-2007.pdf
+  * SUMITOMO EME-6710S: http://www.maximintegrated.com/emmi/pdfs/msds/MSDS_SUMITOMO_EME-6710S_08-08-2006_R02-19-2008.pdf
 Things to look into:
   * Characterization of Integrated Circuit Packaging Materials