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Trace: • resources • eda • lapping • contamination_control • mask • microscope • eeprom • eprom • epoxy • process
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carrier:start [2012/06/22 05:12] – [MCM (Multi-Chip Module)] mcmastercarrier:start [2013/11/16 08:00] (current) – mcmaster
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-====== General construction ====== +Types: 
- +  * [[carrier:smt|Surface mount technology (SMT)]] 
-See Carrier components +  * [[carrier:th|Through hole]]
- +
-====== Surface mount technology (SMT) ====== +
- +
-[[smt|Main page]] +
- +
-====== Through hole ====== +
- +
-[[through|Main page]] +
- +
-====== Transistor outline (TO) ====== +
- +
-[[to|Main page]]+
  
 ====== Generic terms and special packaging ====== ====== Generic terms and special packaging ======
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 Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch.  There seem to be two types: Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch.  There seem to be two types:
   * Epoxy blob (below type): die is placed on board, bonded, and then covered with a blob of epoxy.  The most common type   * Epoxy blob (below type): die is placed on board, bonded, and then covered with a blob of epoxy.  The most common type
-  * Upside down dies (above type): I'm not sure the exact mechanism the wires are attached+  * Upside down dies (above type): likely WLCSP with underfill.  Basically a BGA where there is no encapsulant on the die and solder balls are attached directly to bond pads (see BGA below for example of this sort of thing)
   * Flexible circuit: these are common in the line drivers on LCD screens   * Flexible circuit: these are common in the line drivers on LCD screens
  
Line 57: Line 45:
  
 Several dies integrated into one package.  Considerable variety. Several dies integrated into one package.  Considerable variety.
 +
 +
 +===== Flip chip =====
 +
 +A package where the die is mounted upside down.  Usually this implies BGA or similar package.
 +
 +==== Ceramic BGA example ====
 +
 +Had thermal paste to improve conductivity:
 +
 +{{:carrier:xpc7455:package_pasted.jpg?300}}
 +
 +After cleaning:
 +
 +{{:carrier:xpc7455:package_clean.jpg?300}}
 +
 +When most solder balls are removed on the bottom looks like this:
 +
 +{{:carrier:xpc7455:package_bot.jpg?300}}
 +
 +After dissolving some of the epoxy on the top:
 +
 +{{:carrier:xpc7455:package_some_top.jpg?300}}
 +{{:carrier:xpc7455:package_some_side.jpg?300}}
 +
 +As can see in above though there was still some underfill left.  Next pictures show the epoxy/underfill not completley dissolved and some gunk (solder paste?) left in the center as well as some sort of spacer:
 +
 +{{:carrier:xpc7455:package_some_nodie.jpg?300}}
 +{{:carrier:xpc7455:package_some_ga.jpg?300}}
 +
 +{{:carrier:xpc7455:die_some.jpg?300}}
 +{{:carrier:xpc7455:die_some_closeup.jpg?300}}
  
  
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 ====== References ====== ====== References ======
  
-   1. http://en.wikipedia.org/wiki/Chip_carrier+  * http://en.wikipedia.org/wiki/Chip_carrier 
 +  * http://en.wikipedia.org/wiki/List_of_integrated_circuit_packaging_types
  
carrier/start.1340341947.txt.gz · Last modified: 2013/10/20 14:59 (external edit)