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carrier:start [2013/11/16 07:49] – mcmastercarrier:start [2013/11/16 08:00] (current) – mcmaster
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 Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch.  There seem to be two types: Bare silicon chip without a package and affixed directly to the circuit board. Use in cost sensitive (ie cheap) applications. Above is probably from a commodity wrist watch.  There seem to be two types:
   * Epoxy blob (below type): die is placed on board, bonded, and then covered with a blob of epoxy.  The most common type   * Epoxy blob (below type): die is placed on board, bonded, and then covered with a blob of epoxy.  The most common type
-  * Upside down dies (above type): likely WLCSP with underfill.  Basically a BGA where there is no encapsulant on the die and solder balls are attached directly to bond pads+  * Upside down dies (above type): likely WLCSP with underfill.  Basically a BGA where there is no encapsulant on the die and solder balls are attached directly to bond pads (see BGA below for example of this sort of thing)
   * Flexible circuit: these are common in the line drivers on LCD screens   * Flexible circuit: these are common in the line drivers on LCD screens
  
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 ===== Flip chip ===== ===== Flip chip =====
  
-A package where the die is mounted upside down.  Usually this implies BGA or similar package.  Example BGA on a ceramic substrate...+A package where the die is mounted upside down.  Usually this implies BGA or similar package. 
 + 
 +==== Ceramic BGA example ====
  
 Had thermal paste to improve conductivity: Had thermal paste to improve conductivity:
Line 56: Line 58:
  
 After cleaning: After cleaning:
-{{:carrier:xpc7455:package_top.jpg?300}} 
  
-When solder balls are removed on the bottom looks like this:+{{:carrier:xpc7455:package_clean.jpg?300}} 
 + 
 +When most solder balls are removed on the bottom looks like this: 
 {{:carrier:xpc7455:package_bot.jpg?300}} {{:carrier:xpc7455:package_bot.jpg?300}}
  
 After dissolving some of the epoxy on the top: After dissolving some of the epoxy on the top:
 +
 {{:carrier:xpc7455:package_some_top.jpg?300}} {{:carrier:xpc7455:package_some_top.jpg?300}}
 {{:carrier:xpc7455:package_some_side.jpg?300}} {{:carrier:xpc7455:package_some_side.jpg?300}}
Line 69: Line 74:
 {{:carrier:xpc7455:package_some_nodie.jpg?300}} {{:carrier:xpc7455:package_some_nodie.jpg?300}}
 {{:carrier:xpc7455:package_some_ga.jpg?300}} {{:carrier:xpc7455:package_some_ga.jpg?300}}
-{{:carrier:xpc7455:die_some_closeup.jpg?300}} 
-{{:carrier:xpc7455:die_some.jpg?300}} 
- 
  
 +{{:carrier:xpc7455:die_some.jpg?300}}
 +{{:carrier:xpc7455:die_some_closeup.jpg?300}}
  
  
carrier/start.1384588183.txt.gz · Last modified: 2013/11/16 07:49 by mcmaster