Differences

This shows you the differences between two versions of the page.

--- probe_card [2016/12/02 19:15] – created mcmaster
+++ probe_card [2016/12/02 19:23] (current) – mcmaster
@@ Line 1: / Line 1: @@
+Occasionally package leadframe loses integrity.  Normal options are to rebond or microprobe.  But I don't have a bonding machine and there are too many pins to microprobe.  Exploring building a probe card
+TODO:
+  * CAD target padframe
+    * Measure bond pad size
+    * Minimum pad spacing
 ====== Vendors ======
+Include:
+  * Cascade Microtech
+  * CERPROBE
+  * ESH Inc.
+  * Kulicke & Soffa
+  * Probelogic
+  * Probe Technology
 Examples:
@@ Line 15: / Line 31: @@
-====== Build machine ======
+====== Build/repair station ======
+====== Template ======
+My milling machine will do maybe up to 2 mil => 50 um
+Hmm this sounds too imprecise
+Laser drill kapton, mylar?  Should be very precise and strong enough
+====== References ======
+http://www.tek.com/dl/Probe_Card_Tutorial_WP.pdf
+  * excellent read