probe_card
Table of Contents
Occasionally package leadframe loses integrity. Normal options are to rebond or microprobe. But I don't have a bonding machine and there are too many pins to microprobe. Exploring building a probe card
TODO:
- CAD target padframe
- Measure bond pad size
- Minimum pad spacing
Vendors
Include:
- Cascade Microtech
- CERPROBE
- ESH Inc.
- Kulicke & Soffa
- Probelogic
- Probe Technology
Examples:
- Cascade Microtech HP-4071 112-150
- Probelogic 30-10089-1 Rev A Device# 98Y11 HPL
- Probe Technology C48-1 Rev E Device# 9940A #1
- Probe Technology 811-0205-01 Rev A Device# 5968-TC-HEX
- Probe Technology C48-5XL Device #98404A
- CERPROBE PC404C Device# PROMETRIX
- SV Probe Tech
- CERPROBE PC404CXL Device# 98R21-HPL
- ESH Inc. J941-UDB-03 Rev ESH17-90 A
- Kulicke & Soffa 811-0318-01 Rev A Device# K8SLM-SRAM
- PROBE SV-J953V-256 P/N 888079
Build/repair station
Template
My milling machine will do maybe up to 2 mil ⇒ 50 um
Hmm this sounds too imprecise
Laser drill kapton, mylar? Should be very precise and strong enough
References
http://www.tek.com/dl/Probe_Card_Tutorial_WP.pdf
- excellent read
probe_card.txt · Last modified: 2016/12/02 19:23 by mcmaster