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Table of Contents
A foundry is an IC fabrication facility.
List of foundries
BAE Systems
BAE Systems Information and Electronic Systems Integration, Inc. (Manassas, VA) BAE Systems Micrwave Electronics Center Nashua (Nashua, NH)
Chartered Semiconductor Manufacturing (CSM)
Acquired by Global Foundries in 2010 0.13 µm 300 mm wafers
Dongbu 90 nm to 0.35 um “Dongby HiTek's broad and deep semiconductor expertise encompasses High Voltage (HV), Application-Specific Integrated Circuit (ASIC), CMOS Image Sensor (CIS), Digital Signal Processor (DSP), Microcontroller Unit (MCU), and Non-Volatile Memory (e-Flash) devices.”
Grace Semiconductor
Processes
- 0.25 um
- 0.18 um
- 0.16 um
- 0.15 um
- 0.14 um
- 0.13 um
- 0.115 um
He Jian Technology Corporation (HJTC)
Processes
- 0.18 um
- 0.25 um
- 0.35 um
- 8“ and 200 mm wafers
Honeywell
Honeywell Aerospace Plymouth (Plymouth, MN)
HRL Labratories LLC
Malibu, CA
IBM
Main article
Intersil Corporation
Palm Bay. FL
MagnaChip
Processes
- 0.5 um
- 0.35 um
- 0.30 / 0.25 um
- 0.18 / 0.16 um
- 0.15 um
- 0.13 / 0.11 um
- 90 nm
National Semiconducdtor Corporation
- South Portland, ME
- 0.65 um to 0.13 um
- CMOS and BiCMOS with SOI, SiGe, and Hi Voltage
- Ability to add unique number generator to ID individual dies: 256 bit
NEC
Shanghai Hua Hong NEC Electronics Company, Ltd.
- 1 um
- 0.5 um
- 0.45 um
- 0.35 um
- 0.3 um
- 0.25 um
- 0.18 um
- 0.162 um
- 0.16 um
- 0.13 um
Silterra Malaysia Sdn. Bhd.
Processes
- 0.13µm
- 0.18µm
- 0.22µm
Semiconductor Manufacturing International Corporation (SMIC)
Processes
- 350 nm to 45nm
Foundries
- 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai (Mega-fab)
- Two 300mm wafer fabs in its Beijing (Mega-fab)
- 200mm wafer fab in Tianjin
- 200mm wafer fab under construction in Shenzhen
- 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and managed and operated by SMIC
- 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation and managed and operated by SMIC
SSMC
0.25 um - 0.14 um 200 mm and 300 mm wafers
Northrup Gruman
Nortrup Grumman Electronic Systems (Blatimore, MD) Northrup Grumman Space Technology (Redondo Beach, CA)
ON Semiconductor
Processes
- I3T25 @ 0.35 µm
- I3T50 @ 0.35 µm
- I3T80 @ 0.35 µm
- C5F/C5N @ 0.50 µm
- I2T100 @ 0.70 µm
- I2T30 @ 0.70 µm
Peregrine
Processes
- GA @ 0.25 µm
- GC @ 0.25 µm
- FA @ 0.50 µm
- FC @ 0.50 µm
Rayethon RF Components
Andower, MA
SAMSUN Semiconductor
Processes
- 90 nm
- 65 nm
- 45 nm
- 45/40nm
- 32/28nm
300 mm wafers
Sarnoff Corporation
Princeton, NJ
Semiconductor Manufacturing International Corporation (SMIC)
0.35 um to 90nm
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
Produces ICs for many third parties include such large organizations as nVidia. TODO: image some nVidia chips to see if we can capture some identifying marks. Processes
- CLN40/CMN40 @ 40 nm
- CLN45/CMN45 @ 45 nm
- CLN65/CMN65 @ 65 nm
- CLN90/CMN90 @ 90 nm
- CL013/CM013 @ 0.13 µm
- CL013LP @ 0.13 µm
- CL013LV @ 0.13 µm
- CL018/CM018 @ 0.18 µm
- CL018HV @ 0.18 µm
- CL018LP @ 0.18 µm
- CL018LV @ 0.18 µm
- CL025/CM025 @ 0.25 µm
- CL035/CM035 @ 0.35 µm
- CL035HV_BCD @ 0.35 µm
- CL035HV_DDD @ 0.35 µm
- “65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm”
Texas Instruments (TI)
Processes
- 32 nm
- 45 nm
- 90 nm
- 130 nm
- 200 mm wafers
TowerJazz
Israel: 6” and 8”
US: 8”
China “manufacturing partnerships”
“silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies”
TriQuint Semiconductor
TriQuint Semiconductor Texas (Richardson, TX)
United Microelectronic Corporation (UMC)
Processes
- 28 nm
- 40 nm
- 65 nm
- 90 nm
- 0.13 um
- 0.15 um
- 0.18 um
- 0.25 um
- 0.35 um
- 0.5 um
- 0.6 um
- 8” wafers
Vanguard International Semiconductor Corporation (VIS)
0.18um to 0.5um
8“ wafers
X-FAB Semiconductor Foundries
“CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”
