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A foundry is an IC fabrication facility.
List of foundries
Sarnoff Corporation
Semiconductor Manufacturing International Corporation (SMIC)
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
Produces ICs for many third parties include such large organizations as nVidia.
TODO: image some nVidia chips to see if we can capture some identifying marks.
Processes
CLN40/CMN40 @ 40 nm
CLN45/CMN45 @ 45 nm
CLN65/CMN65 @ 65 nm
CLN90/CMN90 @ 90 nm
CL013/CM013 @ 0.13 µm
CL013LP @ 0.13 µm
CL013LV @ 0.13 µm
CL018/CM018 @ 0.18 µm
CL018HV @ 0.18 µm
CL018LP @ 0.18 µm
CL018LV @ 0.18 µm
CL025/CM025 @ 0.25 µm
CL035/CM035 @ 0.35 µm
CL035HV_BCD @ 0.35 µm
CL035HV_DDD @ 0.35 µm
“65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm”
Texas Instruments (TI)
Processes
32 nm
45 nm
90 nm
130 nm
200 mm wafers
TowerJazz
Israel: 6” and 8”
US: 8”
China “manufacturing partnerships”
“silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies”
TriQuint Semiconductor
TriQuint Semiconductor Texas (Richardson, TX)
United Microelectronic Corporation (UMC)
Processes
28 nm
40 nm
65 nm
90 nm
0.13 um
0.15 um
0.18 um
0.25 um
0.35 um
0.5 um
0.6 um
8“ wafers
Vanguard International Semiconductor Corporation (VIS)
0.18um to 0.5um
8” wafers
X-FAB Semiconductor Foundries
“CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”
References
