In order to make sure we're all on the same page, here are a few conventions to follow.
Layer name
TLDR:
mcmaster:
I've been calling intermediate etchings in more complex processes like s3-7 meaning sample 3, processing step 7
This avoids spending too much time trying to classify something that isn't really a purely poly or active
Conventions:
Active/implant/STI layer
Polysilicon layer
If chip only has one poly layer: poly
If chip has more than one poly layer: polyN, where N starts from 1 at the lowest layer and counts up
Metal layer
If the number of layers in the chip is known (from a cross section, etc): mN, where N starts from 1 at the lowest layer and counts up
If the number of layers is not known: mN, where N starts from the letter Z at the upper layer and counts down. In particular, MZ means top metal layer, regardless of total layer count
Image
High resolution images should be named like: <vendor>_<id>_<layer>_<image type>.jpg
Required fields: vendor, id. Add the others if you have them
Spaces are not allowed. Fields should not have _'s. Translate these to -'s if needed
Some sample image names:
st_24c02_mz_ns50xu.jpg: ST Microelectronics (vendor) 24C02 (chip id). Top metal (mz) image taken with NeoSPlan 50x objective
st_24c02_mz.jpg: Like above, but capture information unknown. It appears to be top metal, so this is added in. Although no objective is given, implied that its brightfield
Complex example
ti_tms32010c-70015_s1-2_mit20x_rom.jpg
Vendor: Texas Instruments (ti)
Chip: TMS32010C
Chip variant: 70015 (in this case the ROM programming)
s1-2: sample 1, processing step 2. Please list processing steps on wiki page if available
mit20x: objective used
rom: a region of interest within the 20x scan
wafer example
mos_8564r6-wafer_mz_die.jpg: a MOS 8564R6 wafer top metal. Main chip
mos_8564r6-wafer_mz_9079r2.jpg: a MOS 8564R6 wafer top metal, but the test pattern 9079R2
Technique
Abbreviated names for different microscope configurations
Applies | Abbreviation | Name | Notes |
OM | bf | Brightfield | Usually omitted / implied default |
EM | bs | Backscatter | |
OM | df | Darkfield | |
OM | dic | Differential interference contrast | |
EM | se | Secondary electron | |
OM | xpol | Crossed polarizers | |
Where:
Optical
If you've calibrated your microscope against a standard of some sort, please add an overlay with the objective name and a scale bar to your images. (Contact azonenberg if you'd like the GIMP files for our standard overlay, which you can modify for your setup.)
Objective
Please add new objectives to this list as necessary.
NOTE: Imaging typically involves a 10x relay lens to make actual magnification times 10. For example, a Mit20x objective is used with a 10x relay lens to make the final image at 200x magnification on the CCD. However, chip pages should include scale bars whenever possible as sensor size has no relation to pixel size, especially in stitched or downsampled images.
am4x: AmScope 4x
am10x: AmScope 10x
am40x: AmScope 40x
am100x: AmScope 100x (oil immersion)
bli20x: Bausch & Lomb industrial 20x (designed for stereozoom series)
ch2x: cheap supposedly Apo 2x objective that may be made of soda glass (green tinge…). Loosely resembles Seiwa objectives
mit5x: Mitutoyo M Plan Apo 5x
mit10x: Mitutoyo M Plan Apo 10x
mit20x: Mitutoyo M Plan Apo 20x
mit50xn: Mitutoyo M Plan Apo 50x Near UV
mit100x: Mitutoyo M Plan Apo 100x
nikon20x: Nikon M Plan 20x ELWD
neo5x: Olympus Neo 5x
nd5x: Olympus Neo DPlan 5x
ns50x: Olympus Neo SPlan 50x
ns50xu: Olympus Neo SPlan 50x ultra-long working distance (ULWD)
md5x: Olympus MDPlan 5x
ms10x: Olympus MSPlan 10x
ms20x: Olympus MSPlan 20x
ms50x: Olympus MSPlan 50x
ms100x: Olympus MSPlan 100x
opl100x: Olympus Plan 100x Oil 1.25NA
oplcn100x: Olympus Plan CN 100x Oil 1.25NA
sz or zoom: Zoom microscope, generally no scale bar provided because magnification varies (unless that particular zoom setting was calibrated during the same imaging session)
See also
SEM
azonenberg's new standard is: foo_01_type_20kV_10kx_9mm.jpg
“type” may be “se” for secondary electron or “bse” for backscatter.
Magnification should be abbreviated if a multiple of 1000, otherwise written out in full (ex: 3900x, 4kx).
Working distance and accelerating voltage should also be specified to aid in interpretation of the image. Typically for high-resolution images one will use the lowest probe current and smallest aperture that give a good signal-to-noise ratio, so this information is often omitted from the filename.