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Backside analysis can include:
Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal. [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.
With IR imaging and laser fault injection
Camera:
In its simplest form, a CSP can be strobed with a camera flash
You need to excite the silicon with a photo of wavelength no more than 1.1 um (reference: “1234.5eV⋅nm/1.1eV is about 1100 nm. Putting 1100 back into the denominator yields 1.1 eV” (link))
Sergei paper references using 1065 nm laser. The paper shows using IR objectives. So maybe a broadband source would work okay too.
Solutions include: