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Introduction

This process uses a flat “wedge” instead of a round capillary. Since no ball is formed at the end of the wire, the bond is only slightly wider than the wire, which is beneficial for high density bonding. As it takes more time per bond than ball bonding, it is only used now for special applications.

First bond

Second bond

: get a photo

Silicon Pr0n

Table of Contents

Introduction

First bond

Second bond