“The most common arrangement for a D.C. (Direct Current) sputter coater is to make the negative cathode the target material to be sputtered typically gold, platinium or with high vacuum sputter coaters, metals such as chromium and iridium)” [Principles] A magnet is often placed around the target (to increase the chance of ionization?).

Usually DC but sometimes RF power

Sputtering should be done in pure argon, not air. “Always use high purity argon gas of the grade known as 'White spot' this will ensure fast sputter rate and good pump down time” [Principles]

“Average coating times will be of the order of 2 -3 minutes using V = 2.5KV and I = 20 mA” [Principles]

Higher pressure gives a more even surface. Having a larger target also helps to create a more even film [Lab 7]

Putting a negative bias on substrate can produce better films [Lab 7]

Distance between target and substrate is typically a few cm [Techniques]

Optimal temperature varies on a few parameter but 100 mTorr is a good rule of thumb [Techniques, Lab 7]

“For a typical modern magnetron sputter coater” [Principles]:

• Vacuum: 8 x l0-2 to 2 x l0-2 mbar (60 mTorr to 15 mTorr)
• Sputtering Voltage: 100V to 3Kv
• Current: 0 to 50mA
• Deposition: 0 to 25 nm/min
• Grain Size: < 5 nm
• Temperature Rise: < 10°C

Material is typically evaporated in either a “boat” or a filament.

A boat is basically a strip of conductive material with an indentation in the center to hold the material to be evaporated. Current is applied to both ends of the boat to heat it. Boats are usually made of tungsten, a high melting point metal, because it needs to remain solid despite evaporating material inside of it.

Sample is typically mounted upside-down above the boat so that it deposits evenly.

Filaments are similar except that the material is placed inside a spiral. This makes placing the sample a little easier as the evaporation can drift downward.

Factors in choosing a coating material:

• What type of detector are you going to use? Secondary emission and other properties vary from material to material
• Do you have equipment to sufficiently heat it?
• Do you have equipment to achieve the necessary vacuum?
• Does it need to be removed?
• Will depositing it alter the sample?

Good coating material but difficult to remove. Usually sputtered?

Reasonable coating material that is easy to remove. Typically evaporated.

Could possibly work? People sputter Cu without too much trouble in medium vacuum (10E-6 torr)

Might work but generally not used because its difficult to find something to evaporate it from

Probably not usable due to rapid surface oxidation

Less BSE than other materials but must be stored under vacuum to avoid corrosion and requires high vacuum to sputter [Principles]

Requires high vacuum to sputter [Principles]

• Sputter Coater Principles (“Principles”): http://www.emsdiasum.com/microscopy/technical/datasheet/sputter_coating.aspx
• Lab 7: http://users.wfu.edu/ucerkb/Nan242/L07-Sputtering_a.pdf
• Sputter Deposition Techniques (“Techniques”): http://www.uccs.edu/~tchriste/courses/PHYS549/549lectures/sputtertech.html